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Schwer und Kopka GmbH - effiziente Prozess- und  Werkzeugüberwachung Ihrer Produktionsmaschinen

The international trade fair for sheet metal working “Bleckexpo” took place in Stuttgart for the 13th time this year. From November 7th to 13th, 2017, the visitors to the stand of schwer + kopka in Hall 7 were presented with the latest innovations in process monitoring and data acquisition in the field of stamping.

In addition to the proven monitoring techniques, such as the ASS technology for automatic sensor detection, visitors were also presented with innovations such as the "Condition Monitoring" module, which is now available for the current series of our process monitors. Condition Monitoring makes it possible to connect additional sensors to the existing monitoring device. These can be, for example, sensors for temperatures, pressures, oscillations, current consumption, use of compressed air or other measurands that are important for the state of the machine. For each signal, there are freely definable warning and shutdown limits, which ensure that not only the stamping process is optimally protected, but also the machines re "ding weel". With the in-house developed software PTO, this data can also be archived in the network and used for long-term evaluations.